Samsung has produced a prototype 900-layer V-NAND chip by bonding two 450-layer wafers using Cell Multi-Bonding technology, according to ET News via SamMobile and coverage in PC Gamer.

Current mass production peaks at SK Hynix's 321 layers, so this prototype nearly triples density while addressing warping and alignment issues during bonding.

The development occurs amid AI-driven demand that has pushed NAND prices higher, with the piece noting that normalization could lead to larger, more affordable SSDs once supply pressures ease.

Metrics and timelines for volume production remain unspecified in available reports.